Electronic & Optical Current Transformers: Rogowski Coil, LPCT, Faraday Effect & IEC 61850-9-2 Digital Output Guide
Thomas Insights

Electronic & Optical Current Transformers: Rogowski Coil, LPCT, Faraday Effect & IEC 61850-9-2 Digital Output Guide

May 5, 2026 Documents

Electronic & Optical Current Transformers: Rogowski Coil, LPCT, Faraday Effect & IEC 61850-9-2 Digital Output Gu...

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Electronic & Optical Current Transformers: Rogowski Coil, LPCT, Faraday Effect & IEC 61850-9-2 Digital Output Guide

Meta Description: Comprehensive guide on electronic and optical current transformers (ECT/OCT). Covers Rogowski coil, low-power coil (LPCT), Faraday effect optical CT, electronic voltage transformers (EVT), merging units, IEC 61850-9-2 digital output, and smart substation integration. Includes selection methodology, testing procedures, and comparison with conventional CTs.


1. Introduction

Electronic Current Transformers (ECTs) and Optical Current Transformers (OCTs) represent the next generation of instrument transformer technology, designed for digital substations and smart grid applications. Unlike conventional CTs that use magnetic cores and copper windings, ECTs/OCTs use electronic sensors, optical fibers, and digital communication to transmit measured current values.

These technologies offer significant advantages:
Wide bandwidth → Accurate measurement of harmonics, transients, and DC components
No saturation → Linear response from milliamps to hundreds of kA
Light weight → No heavy iron cores or oil/gas insulation
Digital output → Native IEC 61850-9-2/LE process bus interface
Safety → No open-circuit hazard, intrinsic safety

This guide systematically covers ECT/OCT working principles, sensor technologies, merging unit architecture, digital communication standards, and selection methodology per IEC 61869-9:2016 and IEC 61850-9-2 standards.


2. Electronic Current Transformer (ECT) Technologies

2.1 Rogowski Coil

2.1.1 Working Principle

A Rogowski coil is an air-core coil that produces a voltage proportional to the rate of change of current (di/dt):

V_out = -M × (di/dt)

Where:
V_out = Output voltage
M = Mutual inductance (typically 0.1-10 μH)
di/dt = Rate of change of primary current

The output voltage must be integrated to obtain the primary current:

i(t) = -(1/M) × ∫ V_out dt

2.1.2 Construction

    Primary Conductor
    │
    │  ┌─────────────────────────────┐
    │  │    Air-Core Coil            │
    │  │    (Non-magnetic former)    │
    │  │    ┌─────────────────────┐  │
    │  │    │ Enamel wire wound    │  │
    │  │    │ uniformly around     │  │
    │  │    │ non-magnetic core    │  │
    │  │    └─────────────────────┘  │
    │  │                             │
    │  │    Return wire (cancels    │
    │  │    external field pickup)  │
    │  └─────────────────────────────┘
    │
    Integrator Circuit
    │
    Output (Analog or Digital)

2.1.3 Characteristics

Parameter Typical Value Notes
Ratio Defined by mutual inductance and integrator Programmable
Bandwidth 0.1 Hz to 1 MHz Excellent high-frequency response
Accuracy Class 0.2, 0.5, 5P (with integrator) Depends on integrator quality
Linear Range 1 A to 100 kA No saturation
Output mV/V (analog) or digital Requires integrator
Burden None (voltage output) No loading effect

2.1.4 Advantages and Limitations

Advantages Limitations
No magnetic saturation Requires external integrator
Wide frequency response Susceptible to EMI (without shielding)
Light weight, compact Low output voltage (mV range)
Intrinsic safety Integrator drift (analog)
Cost-effective Accuracy depends on integrator

2.2 Low-Power Coil (LPCT)

2.2.1 Working Principle

LPCT is a conventional CT with a significantly reduced secondary output:

Standard CT:  5A or 1A secondary → VA burden 5-30 VA
LPCT:         0-4V or 4-20mA secondary → VA burden < 0.1 VA

The LPCT operates at low flux density, avoiding saturation while maintaining linearity.

2.2.2 Construction

    Primary Conductor
    │
    │  ┌─────────────────────────────┐
    │  │    Low-Permeability Core    │
    │  │    (Amorphous or Silicon)   │
    │  │    ┌─────────────────────┐  │
    │  │    │ Secondary Winding   │  │
    │  │    │ (Many turns, fine   │  │
    │  │    │ wire, high resistance)│
    │  │    └─────────────────────┘  │
    │  │                             │
    │  │    Burden Resistor          │
    │  │    (Precision, low tempco)  │
    │  └─────────────────────────────┘
    │
    Output: 0-4V or 4-20mA

2.2.3 Characteristics

Parameter Typical Value Notes
Output 0-4V, 4-20mA, or ±4V Standardized per IEC 60044-8
Accuracy Class 0.2, 0.5, 5P Comparable to conventional CT
Linear Range 0.01 In to 100 In No saturation up to 100×
Burden < 0.1 VA Very low
Frequency Response 10 Hz to 3 kHz Good for power frequency

2.2.4 Standardized Outputs per IEC 60044-8

Output Type Range Application
Voltage Output 0-4V (metering), ±4V (protection) Analog input to IED
Current Output 4-20mA Legacy analog systems
Digital Output IEC 61850-9-2 (Sampled Values) Digital substation

3. Optical Current Transformer (OCT) Technologies

3.1 Faraday Effect (Magneto-Optic)

3.1.1 Working Principle

The Faraday effect describes the rotation of polarized light in a magneto-optic material when subjected to a magnetic field:

θ = V × H × L

Where:
θ = Rotation angle (radians)
V = Verdet constant (material property)
H = Magnetic field strength
L = Optical path length

The rotation angle is proportional to the current:

θ = V × N × I / L × L = V × N × I

Where N = Number of turns (fiber loops).

3.1.2 Construction

    Primary Conductor
    │
    │  ┌─────────────────────────────┐
    │  │    Optical Fiber Loop       │
    │  │    (Around conductor)       │
    │  │                             │
    │  │  Light Source (LED/LD)      │
    │  │    │                        │
    │  │  Polarizer                  │
    │  │    │                        │
    │  │  Fiber Loop (N turns)       │
    │  │    │ (Faraday rotation)     │
    │  │  Analyzer                   │
    │  │    │                        │
    │  │  Photodetector              │
    │  │    │                        │
    │  │  Signal Processing          │
    │  └─────────────────────────────┘
    │
    Output: Digital (Fiber Optic)

3.1.3 Characteristics

Parameter Typical Value Notes
Accuracy Class 0.2, 0.5, 5P Per IEC 61869-9
Bandwidth DC to 10 kHz Full spectrum
Linear Range 1 A to 100 kA No saturation
Insulation Optical fiber (intrinsic) Excellent
Temperature Stability ±0.5% over -40°C to +70°C Requires compensation
Output Digital (fiber optic) IEC 61850-9-2

3.1.4 Types of OCT

Type Sensing Element Advantages Limitations
Bulk Glass Glass rod Simple, robust Temperature sensitive
Optical Fiber Fiber coil Flexible, compact Polarization fading
Hybrid (Fiber + Bulk) Fiber + glass Balanced performance Complex
Reflective Mirror at far end Single fiber Alignment critical

3.2 Active Optical CT (Hybrid)

Description: Combines conventional CT or Rogowski coil with optical signal transmission.

    Primary Conductor
    │
    │  ┌─────────────────────────────┐
    │  │    Sensor (Rogowski/LPCT)   │
    │  │    │                        │
    │  │  ADC (at high potential)    │
    │  │    │                        │
    │  │  Optical Transmitter        │
    │  │    │ (Fiber optic)          │
    │  └─────────────────────────────┘
    │
    Optical Fiber
    │
    ┌───────────────────────────────┐
    │    Optical Receiver (at ground)│
    │    │                          │
    │  Signal Processing            │
    │    │                          │
    │  Digital Output               │
    └───────────────────────────────┘

Advantages:
– Proven sensor technology (Rogowski/LPCT)
– Optical isolation (no electrical connection)
– Digital output at ground potential
– Lower cost than pure OCT

Limitations:
– Requires power at high potential (optical power transmission or battery)
– More complex than passive OCT


4. Merging Unit (MU) Architecture

4.1 Function of Merging Unit

The Merging Unit (MU) is the interface between ECT/OCT sensors and digital protection/control systems:

    Sensor 1 (Phase A) ──┐
    Sensor 2 (Phase B) ──┼── Merging Unit ── IEC 61850-9-2 (SV) ── IEDs
    Sensor 3 (Phase C) ──┤   (MU)
    EVT 1 (Phase A) ─────┤
    EVT 2 (Phase B) ─────┤
    EVT 3 (Phase C) ─────┘

4.2 MU Functions

Function Description Standard Reference
Analog-to-Digital Conversion Sample sensor outputs at 4 kHz (80 samples/cycle at 50 Hz) IEC 61850-9-2
Time Synchronization Timestamp samples with IRIG-B/IEEE 1588 IEC 61850-9-2
Data Formatting Package samples in ASDU (Application Service Data Unit) IEC 61850-9-2
Quality Flags Indicate data validity, test mode, synchronization status IEC 61850-9-2
Communication Transmit via Ethernet (process bus) IEC 61850-9-2

4.3 Sampling Rate and Resolution

Parameter Value Notes
Sampling Rate 4000 Hz (50 Hz system), 4800 Hz (60 Hz system) 80 samples/cycle
Resolution 16-bit ±32768 counts
Data Rate ~1.2 Mbps per MU (6 channels) Ethernet compatible
Jitter < 10 μs Critical for protection
Synchronization IRIG-B, IEEE 1588 PTP, GPS < 1 μs accuracy

4.4 IEC 61850-9-2 Sampled Values (SV)

ASDU Structure:

Field Size Description
AppID 16-bit Application identifier
Length 16-bit ASDU length
ASDU Number 16-bit ASDU count
SmpCnt 16-bit Sample count (0-79)
ConfRev 32-bit Configuration revision
Data 16-bit × N Sampled values (A, B, C, I0, V, etc.)
Quality 32-bit Validity, test, overflow, etc.
Timestamp 64-bit UTC timestamp

5. Technical Specifications per IEC 61869-9

5.1 Accuracy Classes

Class Ratio Error (%) Phase Displacement (cr) Application
0.1 ±0.1 ±5 High-accuracy metering
0.2 ±0.2 ±10 Revenue metering
0.5 ±0.5 ±20 General metering
1 ±1.0 ±40 Indication
5P ±5.0 ±240 Protection
TPX Per specification Per specification Transient protection
TPY Per specification Per specification Transient protection

Note: 1 centiradian (cr) = 0.01 rad = 0.573°

5.2 Rated Values

Parameter Standard Values Notes
Rated Primary Current 50 A to 4000 A Per application
Rated Output 0-4V, ±4V, 4-20mA, digital Per sensor type
Rated Frequency 50 Hz or 60 Hz Power frequency
Insulation Level Per IEC 60076-3 System dependent
Environmental -40°C to +70°C Outdoor rated

5.3 Transient Performance

Class Total Transient Error (%) Application
TPX ≤ 10% Fast protection
TPY ≤ 10% Auto-reclosing
TPZ AC component only Ultra-fast protection

6. Selection Methodology

6.1 Step-by-Step Selection Process

Step 1: Determine Application Requirements

- Substation type (conventional, digital, hybrid)
- Voltage level
- Protection scheme requirements
- Metering accuracy requirements
- Communication infrastructure (process bus, station bus)
- Budget constraints

Step 2: Select Sensor Technology

Application Recommended Technology Reason
New Digital Substation OCT or Hybrid ECT + MU Native digital output
Retrofit Digital Rogowski + MU Easy installation, no saturation
High-Voltage (245kV+) OCT (Faraday) Excellent insulation, compact
Medium-Voltage LPCT + MU Proven, cost-effective
Transient Measurement Rogowski Wide bandwidth, no saturation
DC Measurement Rogowski or Faraday OCT DC response

Step 3: Determine Accuracy Class

Application Accuracy Class Notes
Revenue Metering 0.2S IEC 62053 compliance
Protection 5P or TPY Match relay requirements
SCADA/Indication 1.0 Sufficient for monitoring
Power Quality 0.5 Harmonic measurement

Step 4: Select Merging Unit

Parameter Requirement Notes
Number of Inputs 3-phase CT + 3-phase VT + residual Per bay
Sampling Rate 4000 Hz (50 Hz) or 4800 Hz (60 Hz) IEC 61850-9-2
Communication IEC 61850-9-2 LE or 9-2 Process bus
Synchronization IRIG-B or IEEE 1588 Time stamping
Redundancy Dual MU (optional) Critical protection

6.2 ECT/OCT vs. Conventional CT Comparison

Parameter Conventional CT ECT (Rogowski/LPCT) OCT (Faraday)
Saturation Yes (core limitation) No No
Bandwidth Limited (50/60 Hz ±5%) Wide (DC to 1 MHz) Wide (DC to 10 kHz)
Dynamic Range 0.01 In to 20 In 0.001 In to 100 In 0.001 In to 100 In
Weight Heavy (iron core) Light Very light
Insulation Oil/SF6/Resin Optical fiber Optical fiber
Output Analog (5A/1A) Analog/Digital Digital
Open Circuit Dangerous Safe Safe
Cost Low (LV), High (HV) Moderate High (decreasing)
Maturity Proven (100+ years) Proven (20+ years) Emerging (10+ years)

7. Installation and Integration

7.1 Sensor Installation

Sensor Type Installation Method Notes
Rogowski Coil Slip around conductor Flexible, no disconnection
LPCT Fixed mounting Similar to conventional CT
OCT (Bulk) Fixed on bushing Precision alignment required
OCT (Fiber) Fiber wrapped around conductor Flexible, lightweight

7.2 Merging Unit Installation

Parameter Requirement Notes
Location Control house or bay cabinet Near IEDs
Power Supply DC 110V/220V redundant Uninterruptible
Communication Fiber optic Ethernet Process bus
Synchronization IRIG-B or IEEE 1588 GPS or master clock
Environment Indoor, 0-50°C Climate controlled

7.3 Process Bus Architecture

    ┌─────────────────────────────────────────────┐
    │            Process Bus (IEC 61850-9-2)      │
    │                                             │
    │  MU-1 ──┐                                   │
    │  MU-2 ──┼── Ethernet Switch ── IED-1 (Protection)
    │  MU-3 ──┤                    ── IED-2 (Metering)
    │  MU-4 ──┘                    ── IED-3 (Control)
    │                                             │
    │  Multicast Sampled Values (SV)              │
    │  4000 Hz, 80 samples/cycle                  │
    └─────────────────────────────────────────────┘

8. Testing Procedures

8.1 Factory Tests per IEC 61869-9

Test Purpose Acceptance Criteria
Ratio Test Verify transformation ratio Within class tolerance
Phase Displacement Test Verify phase accuracy Within class limit
Linearity Test Verify linear range Error within class
Frequency Response Test Verify bandwidth Per specification
Temperature Test Verify accuracy over temperature range Within class
EMC Test Verify immunity to interference Per IEC 61000-4
Insulation Test Verify insulation integrity Withstand voltage
Digital Output Test Verify IEC 61850-9-2 compliance Per standard

8.2 Field Commissioning Tests

Test Method Acceptance Criteria
Visual Inspection Check for damage No damage, proper mounting
Ratio Test Primary injection, compare with reference Within ±0.5%
Phase Displacement Test Compare phase angle with reference Within class limit
Digital Output Test Capture SV stream, verify format IEC 61850-9-2 compliant
Synchronization Test Verify timestamp accuracy < 1 μs error
Secondary Injection Verify IED operation IED operates correctly
End-to-End Test Primary injection, verify IED response Correct operation

8.3 Periodic Maintenance

Test Interval Acceptance Criteria
Visual Inspection Annual No damage, secure connections
Ratio Test 3-6 years Within ±0.5% of baseline
Digital Output Test 3-6 years IEC 61850-9-2 compliant
Synchronization Test Annual < 1 μs error
EMC Verification 6-10 years Per IEC 61000-4

9. Standards and References

9.1 IEC Standards

Standard Title Relevant Sections
IEC 61869-9 CTs – Part 9: ECT Requirements Full document
IEC 61850-9-2 Communication Networks – Sampled Values Full document
IEC 60044-8 Instrument Transformers – Part 8: LPCT Full document
IEC 61000-4 EMC Testing Various parts

9.2 IEEE Standards

Standard Title Relevant Sections
IEEE C57.13 Instrument Transformers §3 (Requirements)
IEEE C37.90 Relay Standards §4 (EMC)
IEEE 1588 Precision Time Protocol Full document

10. Engineering FAQ

Q1: Can ECT/OCT replace conventional CTs in existing substations?

A: Yes, with considerations:
Rogowski coils: Easy retrofit (slip around existing conductors)
LPCT: Requires mounting but same footprint as conventional CT
OCT: Requires new mounting but excellent for new installations
Merging Unit: Required for digital output; analog output possible with signal conditioner
IED Compatibility: Existing IEDs need analog input; new IEDs support digital SV

Q2: How does a Rogowski coil measure DC current?

A: A pure Rogowski coil cannot measure DC (output is proportional to di/dt, which is zero for DC). However:
Hybrid Rogowski: Combines Rogowski (AC) with Hall effect sensor (DC)
Digital integrator: Can include DC offset compensation
Faraday OCT: Inherently measures DC (θ ∝ I, not di/dt)

Q3: What happens if the optical fiber is damaged?

A: Optical fiber damage results in:
Signal loss: No output to MU/IED
Quality flag: IEC 61850-9-2 sets “invalid” flag
Protection behavior: IED may block trip (security) or trip (dependability) per setting
Detection: Optical time-domain reflectometer (OTDR) locates fault

Q4: How do I verify ECT/OCT accuracy in the field?

A: Field verification methods:
1. Primary injection: Compare ECT/OCT output with reference CT
2. Digital analysis: Capture SV stream, analyze ratio and phase
3. Synchronization check: Verify timestamp accuracy with GPS
4. Temperature test: Verify accuracy over temperature range (if possible)

Q5: Are ECT/OCTs suitable for revenue metering?

A: Yes, but:
– Must meet IEC 62053 accuracy requirements (0.2S class)
– Must be certified for metering (not just protection)
– Must include calibration traceability
– Some utilities require conventional CT for revenue due to proven track record


11. Conclusion

Electronic and Optical Current Transformers represent the future of instrument transformer technology, offering unmatched bandwidth, linearity, and digital integration for smart grid applications. While conventional CTs remain dominant in existing substations, ECT/OCT adoption is accelerating in new digital substations and high-voltage applications.

Key selection principles:
Match technology to application: Rogowski (transient), LPCT (cost-effective), OCT (HV, digital)
Verify accuracy class: 0.2S for metering, 5P/TPY for protection
Ensure IEC 61850-9-2 compliance: Critical for digital substation integration
Plan for merging unit: MU is essential for digital output
Consider lifecycle cost: Higher initial cost, lower maintenance, longer lifespan

Design checklist:

☐ Sensor technology selected (Rogowski/LPCT/OCT)
☐ Accuracy class specified per application
☐ Merging unit configured (inputs, sampling, communication)
☐ IEC 61850-9-2 compliance verified
☐ Synchronization method selected (IRIG-B/IEEE 1588)
☐ Process bus architecture designed
☐ Testing and commissioning procedures defined
☐ Maintenance and calibration plan established

Technical Reference: IEC 61869-9:2016, IEC 61850-9-2:2004, IEC 60044-8:2009, IEEE C57.13-2016
Product Reference: Duomatech LZZBJ9 series (conventional CTs), LJK series (zero-sequence CTs) — for applications requiring conventional CTs alongside ECT/OCT